Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11040517 | Printed wiring board and semiconductor package | Yukio Nakamura, Ryohta SASAKI, Junki Somekawa, Yuji TOSAKA, Hiroshi Shimizu +1 more | 2021-06-22 |
| 10933562 | Method for producing FRP precursor and device for producing same | Yuji TOSAKA, Yoshinori Satoh | 2021-03-02 |