Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11047901 | Method of testing an interconnection substrate and apparatus for performing the same | Mee-Hyun Lim, Sung Yeol Kim, Seong Keun Cho, Won-Don Joo, Jae Hong Kim +2 more | 2021-06-29 |
| 11016143 | Apparatus and method of testing a wiring circuit | Mee-Hyun Lim, Sung Yeol Kim, Jae Hong Kim, Kyung Min Lee | 2021-05-25 |