Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11014330 | Veneer panel with thin thermally conductive layer | Zhongfen Ding, Scott Alan Eastman, Michael Paul Humbert, Jacquelynn K M Garofano, Brian St. Rock +2 more | 2021-05-25 |
| 10976120 | Net shape moldable thermally conductive materials | Scott Alan Eastman, Abbas A. Alahyari, Jack Leon Esformes | 2021-04-13 |