Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139178 | Semiconductor package with filler particles in a mold compound | Amit Sureshkumar Nangia, Janakiraman Seetharaman | 2021-10-05 |
| 11121049 | Semiconductor package with a wire bond mesh | Amit Sureshkumar Nangia | 2021-09-14 |