Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10889115 | Liquid discharge head having a wiring substrate with surface wirings connected at both ends via through-wirings | Eiju Hirai, Daisuke Yamada | 2021-01-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10889115 | Liquid discharge head having a wiring substrate with surface wirings connected at both ends via through-wirings | Eiju Hirai, Daisuke Yamada | 2021-01-12 |