Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11118057 | Attenuation material composition, attenuation material and preparation method and use thereof | Pinbo Ding, Jianxin Wei, Bangrang Di, Feng Zhang, Lianbo Zeng +1 more | 2021-09-14 |
| 11037945 | Bonded three-dimensional memory devices and methods for forming the same | Wei Liu, Bater Chelon, Siping Hu | 2021-06-15 |