Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004476 | Multi-column interleaved DIMM placement and routing topology | Hoi San Leung, Steve Zhijian Chen, Richard Jiang Li, Minh-Thanh T. Vo, Kenny Lieu | 2021-05-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004476 | Multi-column interleaved DIMM placement and routing topology | Hoi San Leung, Steve Zhijian Chen, Richard Jiang Li, Minh-Thanh T. Vo, Kenny Lieu | 2021-05-11 |