Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166365 | Printed circuit board and manufacturing method for the same | A-ran Lee, Kee Ju Um, Ju Ho Kim, Myeong Hui Jung, Kyuong-Hwan Lim +2 more | 2021-11-02 |
| 11043440 | Semiconductor package | Hyung Kyu Kim, Seong Chan PARK, Sang Hyun KWON, Han Kim | 2021-06-22 |