Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11047901 | Method of testing an interconnection substrate and apparatus for performing the same | Mee-Hyun Lim, Sung Yeol Kim, Won-Don Joo, Jae Hong Kim, Taek Jin Kim +2 more | 2021-06-29 |