Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11021804 | Plating solution and metal composite and method of manufacturing the same | Kenji Takai, Daiki MINAMI | 2021-06-01 |
| 10961414 | Polishing slurry, method of manufacturing the same, and method of manufacturing semiconductor device | Kenji Takai, Ken Kokubo, Eigo MIYAZAKI, Do Yoon Kim | 2021-03-30 |