Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211254 | Process for integrated circuit fabrication using a buffer layer as a stop for chemical mechanical polishing of a coupled dielectric oxide layer | Yuzhan Wang, Pradeep Basavanahalli Kumarswamy, Hong Kia Koh, Alberto Leotti | 2021-12-28 |