Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145735 | Ohmic alloy contact region sealing layer | Paul J. Duval, John P. Bettencourt, James W. McClymonds, Philip C. Balas, II, Michael S. Davis | 2021-10-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145735 | Ohmic alloy contact region sealing layer | Paul J. Duval, John P. Bettencourt, James W. McClymonds, Philip C. Balas, II, Michael S. Davis | 2021-10-12 |