Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183436 | Power module package and packaging techniques | Shixi Louis Liu, Rishikesh Nikam | 2021-11-23 |
| 11150273 | Current sensor integrated circuits | Shixi Louis Liu, Paul A. David, Shaun D. Milano, Rishikesh Nikam, Alexander Latham +2 more | 2021-10-19 |