Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10986754 | Circuit board module and heat-dissipating board structure thereof | Chia-Hung S. Kuo | 2021-04-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10986754 | Circuit board module and heat-dissipating board structure thereof | Chia-Hung S. Kuo | 2021-04-20 |