Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11208579 | Curable resin composition and adhesive for bonding structural material using composition | Keisuke Ota, Tamotsu Nagamatsu | 2021-12-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11208579 | Curable resin composition and adhesive for bonding structural material using composition | Keisuke Ota, Tamotsu Nagamatsu | 2021-12-28 |