Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189523 | Semiconductor structure and fabrication method thereof | Shing-Yih Shih, Hung-Mo Wu | 2021-11-30 |
| 11063011 | Chip and wafer having multi-layered pad | Chia-Lin Tsai | 2021-07-13 |