Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049790 | Electrically insulating thermal interface on the discontinuity of an encapsulation structure | Edward Fuergut | 2021-06-29 |
| 10930614 | Chip arrangements | Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger, Lim Fong +2 more | 2021-02-23 |