Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168865 | Light-emitting device and backlight | Daisuke Iwakura | 2021-11-09 |
| 11162004 | Electrically conductive adhesive and electrically conductive material | Teppei KUNIMUNE | 2021-11-02 |
| 11114583 | Light emitting device encapsulated above electrodes | Daisuke Iwakura | 2021-09-07 |
| 11101416 | Method for producing light emitting device and sealing resin composition for light emitting device | Katsuyuki Tsunano, Daisuke Niki | 2021-08-24 |
| 10978623 | Light emitting element including adhesive member containing particles | Toshifumi Imura, Tomoki Tanisada | 2021-04-13 |
| 10971656 | Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same | Tomohisa Kishimoto | 2021-04-06 |
| 10950770 | Method for producing an electronic device | Satoru Ogawa, Katsuaki Suganuma, Keun Soo Kim | 2021-03-16 |
| 10941304 | Metal powder sintering paste and method of producing the same, and method of producing conductive material | Teppei KUNIMUNE | 2021-03-09 |