Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964873 | Systems and methods for forming thin bulk junction thermoelectric devices in package | Michael J. Bishop, Gregory L. Tice, Reid A. Black, Vijay M. Iyer | 2021-03-30 |
MC
Mario J. Costello
Overall (2021): #353,548 of 548,734Top 65%
1
Patents 2021