Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135683 | Solder alloy and junction structure using same | Hidetoshi Kitaura, Akio Furusawa | 2021-10-05 |
| 10960496 | Solder alloy and package structure using same | SHINNOSUKE AKIYAMA, Hidetoshi Kitaura, Akio Furusawa | 2021-03-30 |