Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195729 | Substrate polishing apparatus and method | Yuki Watanabe | 2021-12-07 |
| 10916455 | Flattening method and flattening apparatus | Kazuto Yamauchi, Yasuhisa Sano, Hideyuki Hara, Junji Murata | 2021-02-09 |