Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10917602 | Stacked imaging device with Cu-Cu bonding portion | Yasunori Tsukuda | 2021-02-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10917602 | Stacked imaging device with Cu-Cu bonding portion | Yasunori Tsukuda | 2021-02-09 |