Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195757 | Wafer processing method | — | 2021-12-07 |
| 11168236 | Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet | Kenta JOZUKA, Naoaki HIGUCHI, Naohiro Kato, Yasushi Buzojima | 2021-11-09 |
| 11149171 | Thermally-conductive pressure-sensitive adhesive sheet | Yoshio Terada | 2021-10-19 |