Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10928141 | Heat exchanger for cooling multiple layers of electronic modules | Benjamin A. Kenney, Meinrad K. A. Maehler, Jiang Feng Yu | 2021-02-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10928141 | Heat exchanger for cooling multiple layers of electronic modules | Benjamin A. Kenney, Meinrad K. A. Maehler, Jiang Feng Yu | 2021-02-23 |