KS

Kazuma Sekiya

DI Disco: 21 patents #11 of 149Top 8%
Overall (2021): #1,716 of 548,734Top 1%
21
Patents 2021

Issued Patents 2021

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
11188050 Management Method of processing tool 2021-11-30
11167393 Cutting blade and mounting mechanism for cutting blade Yuichiro Matsumi 2021-11-09
11148243 Cutting blade supplying apparatus and cutting blade case 2021-10-19
11110549 Recess or through-hole forming method and electrode forming method Naoki MURAZAWA 2021-09-07
11101162 Chuck table, cutting apparatus, and method correcting chuck table Setsuo Yamamoto 2021-08-24
11096287 Method of manufacturing packaged board 2021-08-17
11072042 Wafer and wafer producing method 2021-07-27
11059673 Conveyance system 2021-07-13
11056374 Protective member forming method 2021-07-06
11036972 Management system for supervising operator 2021-06-15
11018059 SiC substrate processing method 2021-05-25
11011393 Cutting apparatus 2021-05-18
10974364 Cutting blade mounting mechanism 2021-04-13
10974359 Automated workpiece conveying vehicle 2021-04-13
10971350 Wafer holding apparatus and wafer processing method using the same 2021-04-06
10964567 Processing apparatus 2021-03-30
10964572 Conveyance system 2021-03-30
10964571 Conveyance system 2021-03-30
10938339 Installation method of solar panel and solar panel 2021-03-02
10930561 SiC substrate processing method 2021-02-23
10916466 Wafer uniting method 2021-02-09