Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114312 | Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover | Benoit Besancon, Alexandre Mas | 2021-09-07 |
| 10998470 | Cover for an electronic circuit package | Jean-Michel Riviere, Romain Coffy | 2021-05-04 |
| 10965376 | Cover for an electronic circuit package | Jean-Michel Riviere, Romain Coffy | 2021-03-30 |
| 10923638 | Electronic device comprising an optical chip and method of fabrication | Nicolas MASTROMAURO | 2021-02-16 |