Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183444 | Packaging of a semiconductor device with a plurality of leads | — | 2021-11-23 |
| 11037865 | Semiconductor with external electrode | Koshun Saito | 2021-06-15 |
| 10886203 | Packaging structure with recessed outer and inner lead surfaces | — | 2021-01-05 |