Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991597 | Method of fabricating a semiconductor device using an adhesive layer | Kyung Hak Lee, Jaeyong Park, Sungil Cho | 2021-04-27 |
| 10886248 | Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package | Satoshi Inada | 2021-01-05 |