Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11001759 | Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same | Chih-Wei Liao, Chang-Chien Yang, Tsung-Hsien Lin | 2021-05-11 |
| 10994516 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Chih-Wei Liao, Hsien-Te Chen, Tsung-Hsien Lin | 2021-05-04 |
| 10920008 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | Chen-Hua Yu, Chang-Chien Yang, Guan-Syun Tseng, Chih-Wei Liao | 2021-02-16 |