Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166384 | Fabrication process for flip chip bump bonds using nano-LEDs and conductive resin | Karsten Bruening | 2021-11-02 |
| 11067695 | 3D imaging by multiple sensors during 3D printing | — | 2021-07-20 |