Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10962571 | Interposers having cuts through an insulating substrate | Thiha Shwe, Hisashi Ata, James L. Oborny | 2021-03-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10962571 | Interposers having cuts through an insulating substrate | Thiha Shwe, Hisashi Ata, James L. Oborny | 2021-03-30 |