Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10955465 | Method and apparatus for bond wire testing in an integrated circuit | Anthony J. Suto, Joseph F. Wrinn | 2021-03-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10955465 | Method and apparatus for bond wire testing in an integrated circuit | Anthony J. Suto, Joseph F. Wrinn | 2021-03-23 |