Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11022657 | Processor and chipset continuity testing of package interconnect for functional safety applications | Matthew W. Lee, Benedict C. Ofuonye, Erich N. Ewy | 2021-06-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11022657 | Processor and chipset continuity testing of package interconnect for functional safety applications | Matthew W. Lee, Benedict C. Ofuonye, Erich N. Ewy | 2021-06-01 |