Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892384 | Etched trenches in bond materials for die singulation, and associated systems and methods | Vladimir Odnoblyudov, Scott D. Schellhammer | 2021-01-12 |
JF
Jeremy S. Frei
Overall (2021): #411,623 of 548,734Top 80%
1
Patents 2021