JL

Jae Ung Lee

AP Amkor Technology Singapore Holding Pte.: 1 patents #51 of 166Top 35%
Overall (2021): #417,727 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11152296 Semiconductor package and manufacturing method thereof Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more 2021-10-19