Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094854 | Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body | Masaki Hayashi, Shimpei Sasaoka, Tomohide Miki | 2021-08-17 |