Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10937748 | Fan-out transition structure for transmission of mm-Wave signals from IC to PCB via chip-scale packaging | Houssam Kanj, Wenyao Zhai, Morris Repeta | 2021-03-02 |
HP
Hari Krishna Pothula
Overall (2021): #439,222 of 548,734Top 85%
1
Patents 2021