Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164826 | Packaged integrated circuit having stacked die and method for making | Burton J. Carpenter | 2021-11-02 |
| 10992346 | Systems and devices with common mode noise suppression structures and methods | Qiang Li | 2021-04-27 |