Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916509 | Substrate, method of sawing substrate, and semiconductor device | Yun-Rae Cho, Sundae KIM, Hyunggil Baek, Namgyu Baek, Seunghun Shin | 2021-02-09 |
DW
Donghoon Won
Overall (2021): #469,691 of 548,734Top 90%
1
Patents 2021