Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031319 | Thermal interface materials with adhesive selant for electronic components | Kuan-Ting Wu, Kevin Voss | 2021-06-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031319 | Thermal interface materials with adhesive selant for electronic components | Kuan-Ting Wu, Kevin Voss | 2021-06-08 |