Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10953572 | Flexible heat transfer die comprising a thermal interface material | Michael J. Stevenson, Robert A. Reeves, Corey R. Dibrom | 2021-03-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10953572 | Flexible heat transfer die comprising a thermal interface material | Michael J. Stevenson, Robert A. Reeves, Corey R. Dibrom | 2021-03-23 |