Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11008456 | Resin composition and uses of the same | Guan-Syun Tseng, Chen-Hua Yu | 2021-05-18 |
| 11001759 | Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same | Chang-Chien Yang, Tsung-Hsien Lin, Ju-Ming Huang | 2021-05-11 |
| 10994516 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Hsien-Te Chen, Tsung-Hsien Lin, Ju-Ming Huang | 2021-05-04 |
| 10989396 | Illumination device | Chih-Ping Ho, Shyi-Ming Pan | 2021-04-27 |
| 10920008 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | Ju-Ming Huang, Chen-Hua Yu, Chang-Chien Yang, Guan-Syun Tseng | 2021-02-16 |