Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158608 | Semiconductor package including offset stack of semiconductor dies between first and second redistribution structures, and manufacturing method therefor | Kuang-Jen Shen | 2021-10-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158608 | Semiconductor package including offset stack of semiconductor dies between first and second redistribution structures, and manufacturing method therefor | Kuang-Jen Shen | 2021-10-26 |