Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D918036 | Packaging | Ryan David, Hseh Tjun Tereave Lim, Mark T. Uyeda | 2021-05-04 |
| D914517 | Packaging with electronic devices | Ryan David, Hseh Tjun Tereave Lim, Mark T. Uyeda | 2021-03-30 |