DY

Deze YU

📍 Singapore, SG: #396 of 1,679 inventorsTop 25%
Overall (2021): #474,667 of 548,734Top 90%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10937767 Chip packaging method and device with packaged chips Wanning ZHANG 2021-03-02