Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164847 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Tonia G. Morris, Siaw Kang Lai, Yu Ying Ong | 2021-11-02 |
YL
Yee Choong Lim — 1 Patent in 2021
Overall (2021): #203,383 of 548,734Top 40%
1
Patents 2021