Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11164847 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Tonia G. Morris, Siaw Kang Lai, Yu Ying Ong | 2021-11-02 | $26,002,000 |