Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11175709 | Per chiplet thermal control in a disaggregated multi-chiplet system | Amit Jain, Sameer Shekhar, Merwin Brown | 2021-11-16 | $23,453,000 |
| 11081450 | Radiation shield around a component on a substrate | Dong-Ho Han, Jaejin Lee, Je-Young Chang, Jerrod Peterson | 2021-08-03 | $25,424,000 |
| 10932393 | Torsional heat pipe | Juha Paavola, Mikko Makinen, Columbia Mishra | 2021-02-23 | $31,062,000 |
| 10921869 | Chassis embedded heat pipe | Juha Paavola, Nicholas R. Weber | 2021-02-16 | $35,223,000 |