Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950536 | Packed interconnect structure with reduced cross coupled noise | Zhen Zhou, Jun Liao, Xiang Li, Kevin Stone, Tae Young Yang +2 more | 2021-03-16 |
DD
Daqiao Du
Overall (2021): #485,992 of 548,734Top 90%
1
Patents 2021