DD

Daqiao Du

IN Intel: 1 patents #1,968 of 5,160Top 40%
Overall (2021): #485,992 of 548,734Top 90%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
10950536 Packed interconnect structure with reduced cross coupled noise Zhen Zhou, Jun Liao, Xiang Li, Kevin Stone, Tae Young Yang +2 more 2021-03-16