HK

HONG-SHENG KE

IC Inpaq Technology Co.: 1 patents #1 of 7Top 15%
Overall (2021): #431,041 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11152320 Semiconductor package structure and method of the same Yu-Ming Peng, Wei-Lun Hsu, Chu-Chun Hsu, Yu-Chia Chang 2021-10-19