Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910285 | Package structure with TFTS and die covered RDL | Yi-Hung Lin, Cheng-I Wu, Li-Wei Sung, Cheng-Chi Wang, Chin-Lung Ting | 2021-02-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910285 | Package structure with TFTS and die covered RDL | Yi-Hung Lin, Cheng-I Wu, Li-Wei Sung, Cheng-Chi Wang, Chin-Lung Ting | 2021-02-02 |